Electronics Forum: no and clean and misprint (Page 1 of 2)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe

Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:25:07 EST 2001 | markt

I am currently cleaning solder paste and adhesive stencils and misprinted substrates manually by using IPA, chem wipes, Q-tips, etc. Can you recommend a machine and chemistry that will clean all these applications?

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

Stencil and Misprinted Board Cleaning Handbook

Electronics Forum | Tue Jan 08 20:46:09 EST 2013 | davef

Look here: http://www.ipc.org/html/IPC-7526.pdf BR, davef

Common cleaning agent for Water soluble, No-Clean and RMA paste

Electronics Forum | Tue Oct 09 11:22:08 EDT 2001 | nifhail

Can I use one common cleaning agent to clean the stencils from a lines which are using RMA, No-clean and clean paste ( b'cos we onlyhv one stencil cleaner ). What about those misprinted board ? Can all of them use the same chemical or cleaned in the

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