Electronics Forum: no and clean and process (Page 1 of 13)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe

Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Re: No clean and f devices

Electronics Forum | Thu Nov 11 18:28:10 EST 1999 | John Thorup

Hi Jeff Actually it's not necessarily Signal to Noise Ratio or even RF circuitry. All no cleans leave behind residue by description. This residue can affect RF or other high frequency circuits in a number of different ways including SNR. Very high

No clean and 100 Mbps Fast Ethernet Transceiver

Electronics Forum | Wed Oct 01 07:51:13 EDT 2008 | mrmaint

We built tens of thousands of boards with transeivers on them with a no clean process.Never had any problems with the flux residue in relationship to board performance.

Batch cleaner not getting PCBs clean and dry

Electronics Forum | Thu Dec 08 12:39:39 EST 2016 | deanm

We have a name brand aqueous batch cleaner that uses a chemical and DI water to clean ROL0 flux from our PCBs. It does ok most of the time for SMT boards and we want to include through hole assemblies as well which should be a better cleaning process

No clean and 100 Mbps Fast Ethernet Transceiver

Electronics Forum | Tue Sep 30 20:55:14 EDT 2008 | davef

Residues from different no-clean fluxes produce different levels of variation in RF circuits. Some no-clean fluxes work fine. Following this, a no-clean flux can produce different levels of variation in RF circuits depending on the process setup.

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