Electronics Forum: no and solder and fillet (Page 1 of 3)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe

Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Evalution on solder paste and spray flux

Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ

Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

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