Electronics Forum: non (Page 111 of 165)

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip

Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an

Non RoHs Requirement

Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell

If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d

non-wet on 0402 mounted on OSP & lead free paste

Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman

Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce

General SMT Question

Electronics Forum | Thu Nov 20 17:52:30 EST 2008 | orian

Hello Im a uni student trying to find out information on SMT. Ive just spent around 2 hours searching for SMT information and can not find anything. More i spend time trying to figure out how, im starting to think, this is not something you can do

Soldering problem with Au plating PCB

Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter

Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from

Soldering problem with Au plating PCB

Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter

Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became

Soldering problem with Au plating PCB

Electronics Forum | Mon Apr 06 11:58:42 EDT 2009 | c111

Jeong Ju-young You touched them all up with an iron? Wow! We have also had similar issues. What I did to prove there was a board problem was paste one & reflow one bare board with the same chem (noclean) we saw the non-wetting condition. Then applied

CM cost formula

Electronics Forum | Mon Mar 02 15:54:15 EST 2009 | rgduval

That might because every CM has a different overhead rate. In general, your costs should be material+direct labor rate+overhead rate+markup and or profit margin. For your overhead rate, consider your non-direct labor, and your facility costs. Am

Mydata TP-11 Small X not working

Electronics Forum | Tue Apr 21 12:48:13 EDT 2009 | bk

ok you verified that the motor was bad. So now i would go back and verify that your voltages are still good on the back of the computer box and on the booster board. If they all check out fine. I would take the mot x board from your working machine a

board delaminated after reflow

Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse

Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What


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