Electronics Forum: non wetting and solder profile (Page 1 of 9)

BGA non wetting

Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70

Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr

Component non wetting

Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam

Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards

BGA non wetting

Electronics Forum | Tue Sep 14 21:03:42 EDT 2010 | genesan

Hi Sir, The diameter of the aperature is 17mil and thickness 6mil and since we are using Solder Paste Inspection i believe that should have a good paste deposit on this pad.Let say if no good paste it will more create insufficient solder which X-RAY

Solder joint dewetting or non wetting

Electronics Forum | Wed Nov 06 03:51:28 EST 2013 | cuperpeter

Hi rob, Thank you very much for your response. Profiling was made exactly on the pad, which showed dewetting, so the values are mentioned for this pad. PCB's is about a week old. It is possible that the surface of pads is already oxidized? I will t

Solder joint dewetting or non wetting

Electronics Forum | Tue Nov 05 12:34:54 EST 2013 | rgduval

3-6 months, say, depending on the environment), I might consider a ramp-soak-spike profile to allow sufficient time for the flux to clean any potential contaminants. Cheers, ..rob

Solder joint dewetting or non wetting

Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter

Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and

Solder mask vs non solder mask defined pads

Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083

The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas

Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28

Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet

Recommanded profile for 0402 & 0201.

Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail

What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac

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