Electronics Forum | Thu Jul 05 13:47:10 EDT 2007 | arun2382
QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a second time, it recovers and passes testing. Visual, X-ray inspection revealed no anomalies. Cross-section images of solder joint revealed no anomalies (
Electronics Forum | Thu Jul 05 17:10:29 EDT 2007 | arun2382
Thanks all! I'm facing this issue with one specific batch of QFNs. It could be a plating issue. But, nothing was evident from visual inspection,No sign of voiding or non-wetting. Cross-section images of solder joints were clean as well. Could this s
Electronics Forum | Mon May 24 05:53:24 EDT 2004 | johnwnz
Here's an interesting fact, some pastes just don't wet as well as others!.. there I've said it and now people will complain but that's life. Some pastes are formulated to run in air, some in N2, soem are specifically designed to be more aggressive fo
Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Mon Dec 20 16:34:15 EST 2004 | steve
Customer has tried OA and NC alloy solder pads may be nickel Chromium. Non-wetting issue. Scraping pad alloys a bit of adhesion of solder but no intermettalic bond. Any suggestions?
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Wed May 18 14:58:05 EDT 2005 | splice
Hi, I am having some PTH non wetting issues. Setup and chronology of events is explained: Set Up; Part: 1 MM pitch connector 378 pins Solder: Kester Ultra Pure 63/37 solder Pot; 250 C pre heat; Peak 94C top side Flux: Qualitek 775, Fluxer: foam T
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Wed Jan 31 17:57:07 EST 2007 | blnorman
We've had multiple issues with non-wetting components. You say only one part is not wetting? Profile won't be the culprit, if so you would have more part issues. We've used SnPb with lead-free parts for some time now, no issues. The issues we had
Electronics Forum | Fri Mar 21 20:24:13 EST 2003 | msimkin
Has anyone had success in soldering these devices, in particular devices from a company callede Pycomp. They are 8 way 0402 sized terminations. I have experemented with the printing process, placement verification & reflow profile. Unfortuanlty, I am
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