Electronics Forum | Mon Nov 26 17:42:24 EST 2001 | davef
I agree. Voids in plating are bad news and baking will not change that.
Electronics Forum | Mon Nov 26 20:41:24 EST 2001 | davef
Which ramp is this? * Ramp to preheat? * Preheat? * Ramp to spike?
Electronics Forum | Wed Jul 27 10:52:26 EDT 2022 | madisreivik
Can you post pictures here ? It should be quite straightforward to solve.
Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk
We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net
Electronics Forum | Wed Jul 27 17:26:55 EDT 2022 | proceng1
I'm having trouble picturing your setup, but can you put kapton on the columns? Or heat shrink tubing?
Electronics Forum | Wed Nov 21 10:41:03 EST 2001 | arzu
Hello, Sometimes you have no choice other than putting uvias in ubga's-pads. I know examples of high-end mass production of products with ubgas having voids. (no problems, but always voids visable in x-ray) I also performed a DOE a while ago to avoid
Electronics Forum | Wed Nov 21 21:50:50 EST 2001 | Glenn Robertson
Tony, What you are seeing can occasionally be caused by gaps in the plating of the blind vias. If they are not "airtight" you can get moisture coming from the laminate that shows up as voids in the solder balls. You might check on the board sup
Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Wed Jul 27 05:31:09 EDT 2022 | lindsaylbb
Aluminum shreds were found inside the tooling hole after depaneling. We ruled out contamination because the tooling holes were covered during depaneling. Out of three holes, only 2 holes with positioning columns inside have aluminum shreds residue.
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
