Electronics Forum: not and centered and printing (Page 1 of 1)

Spacing and Yield

Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake

The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que

Re: IPC and Nepcon

Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F

I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from year 2000. Can anyone tell me if this is true Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas

We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea

SMT Line and vibration next door

Electronics Forum | Mon Jan 13 14:44:19 EST 2020 | dwl

I wouldn't think the vibration from weights dropping would be significant enough to effect the SMT machines. If you are concerned, look into placing vibration dampening pads under the machine feet. you don't need anything fancy, just neoprene pads wo

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Can UP 2000 printer work with R and L justified stencils?

Electronics Forum | Mon Jul 31 16:33:48 EDT 2006 | G.P.

I think he meant stencils where the print pattern is front, left, or right justified on the stencil itself as opposed to being centerred. Is that what you meant. It can be done on DEK printers, but it has been several years that I worked with an MP

What were your top go-to sources for electronics information and learning in 2018

Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef

Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (

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