Electronics Forum | Fri May 21 07:57:38 EDT 2021 | sophyluo1985
I'm Quinn form Gooldland China I saw on the forum that you have printing presses using FUJI, Have you encountered a problem that you cannot solve? Maybe we can provide you with some help. Please contact me: Quinn Shenzhen Jing Cheng Zhi Yuan Technol
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas
We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea
Electronics Forum | Mon Jan 13 14:44:19 EST 2020 | dwl
I wouldn't think the vibration from weights dropping would be significant enough to effect the SMT machines. If you are concerned, look into placing vibration dampening pads under the machine feet. you don't need anything fancy, just neoprene pads wo
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Mon Jul 31 16:33:48 EDT 2006 | G.P.
I think he meant stencils where the print pattern is front, left, or right justified on the stencil itself as opposed to being centerred. Is that what you meant. It can be done on DEK printers, but it has been several years that I worked with an MP
Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef
Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (
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