Electronics Forum | Wed Sep 23 00:06:34 EDT 2020 | SMTA-64387098
I have modules that come with a 4 x 2 pin header. The problem is the pins must be oxidized as they do not take solder (no wetting occurring). This occurs whether solder in our wave soldering machine or soldered by hand. I tried cleaning the module i
Electronics Forum | Wed Sep 23 13:56:02 EDT 2020 | emeto
Try to pre-tin the part. This should give you a lot of answers.
Electronics Forum | Thu Sep 24 12:59:59 EDT 2020 | davef
If whatever is preventing the leads on your component from wetting is oxidation, cleaning the component will not help. Consider trying a more active flux prior to soldering. Understand from your supplier the potential complications that may affect
Electronics Forum | Thu Sep 24 08:05:59 EDT 2020 | majdi4
In my opinion, it is not possible to eliminate the oxidation in a component because oxidation it is not removable .. the only solution is to apply a mechanical operation (scraping) and then tinning the part..
Electronics Forum | Fri Sep 07 16:26:34 EDT 2018 | m_imtiaz
thanks for your input
Electronics Forum | Wed Aug 29 09:32:27 EDT 2018 | m_imtiaz
Dear All We are using structural similar type of connector in A & B product with same set parameter in selective soldering machine but result in B product is not good. Observation – Plating on A product Connector terminal done on all 4 side But In
Electronics Forum | Sun Sep 09 08:38:14 EDT 2018 | devinpcb
I have found the paste flux is the worst. It leaves a black residue that can corrode.
Electronics Forum | Wed Aug 29 12:12:14 EDT 2018 | solderingpro
What type of flux are you using today? - Obviously you have already outlined the difference in the parent materials and parent material preparation, so using the same program/profile will not work; the characteristics are different. Try increasing p
Electronics Forum | Mon Sep 17 12:21:43 EDT 2018 | bpeay
M_, the parts may be similar but the boards look to be different. Is the thermal relief for each lead on each board the same? what is the board finish, HASL, Enig, OSP or other? The part itself may not be your problem but the part that is partial pla
Electronics Forum | Mon Oct 20 15:24:52 EDT 2008 | davef
During reflow soldering, sometimes via fill with solder leaving the solder connection starved. Questions are: * Specifically, what is the problem you see? * Do the defective pads show that solder has melted in a uniform fashion? * How do the tempera
