Electronics Forum | Thu Oct 30 14:46:33 EDT 2008 | rgduval
I've used DBA in the past. It's not a bad MRP software for the price. Though, your mileage may vary. We were using an older version of it at my last company, and there was no desire to upgrade. From a manufacturing standpoint (bill of material co
Electronics Forum | Tue Nov 11 19:41:06 EST 2008 | gregoryyork
Thats the problem residual residue from HASL fluxes Lead free especially are worse.Very hygroscopic and out gass and produce dewetting as well over wave soldered boards especially. Leave iron on blown joint and will after several seconds fizz and pop
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
Electronics Forum | Mon May 18 17:07:16 EDT 2009 | dilogic
OK - first, look at this page: http://www.jacco2.dds.nl/samba/lanman.html There's a pretty detailed description how to install LanMan client on the OS/2 machine. Some links are broken, but you can find alternate sources on the net. A good site wi
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo
Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca
Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo
I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde
Electronics Forum | Wed Nov 30 15:47:50 EST 2011 | upguy
We have used the Excel macro with great success for our two MyData TP9-UFP machines running TPSys version 1.5.18. It will run in Excel 2000, Excel 2002 and Excel 2003. It will not run under Excel 2007 and later or under StarOffice. I can send the
Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat
We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc
