Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk
Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to
Electronics Forum | Mon Apr 15 21:55:46 EDT 2002 | ianchan
Hi Clark, Out of curiousity and in the name of learning new stuff, can you share with us how does your team, calculate the cost of inspection? Is inspection an additional chargable item in the quotation sheet? To quote your posting : "Just a side n
Electronics Forum | Sun Apr 21 22:46:13 EDT 2002 | ianchan
Hi Mates, Previously posted below question, in another thread, but it din get any reply, so posted afresh in a hope some kind folk can shed some light... ***extract commencement*** Out of curiousity and in the name of learning new stuff, can you s
Electronics Forum | Wed May 22 08:43:40 EDT 2002 | pjc
I have experience cleaning NC for military boards. The reason for cleaning the NC is due to conformal coating requirements. Zestron Vigon A200 and Atron AC 100, as well as Petroferm Hydrex DX have both been effective at cleaning Alpha UP78 NC paste.
Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt
I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve
Electronics Forum | Tue Jun 18 21:17:00 EDT 2002 | Todd
Gee Ken, the old cart business must really be slow, I see you commenting on any old item in the forum in an attempt to hawk your carts and how they improve efficient factory operation. I have read your white paper and found it very entertaining to se
Electronics Forum | Fri Jun 14 13:19:15 EDT 2002 | mjabure
The first question is, is this a high mix, low volume environment or vice versa? If it's the former then Kens solution is something you might want to look into. Depending on your feeder set up you might check to see if your operators have been traine
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
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