Electronics Forum | Tue Mar 01 03:25:33 EST 2005 | bing
We are using a GDM with a linear piston pump fitted to dispence adhesive on 0603's. Use Universal part number 43273801 needle with a 42346504 piston. The single needle dimentions are 0.010 ID, 0.028 OD, 0.005 stand off
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Electronics Forum | Wed Jun 15 22:27:40 EDT 2011 | pkamath2
Hello, My company recently installed a Positive Displacement Pump on a GSM Pick @ Place machine for dispensing chipbonder (loctite 3621) dots before mounting chip components. The head uses Universal stand nozzles (single port-small dot, dual port 0
Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys
| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has
Electronics Forum | Thu Mar 25 12:20:21 EST 2004 | Mike Konrad
OK� Nap time�s over! Technically speaking, water soluble flux is just that, soluble in water. Technically speaking, one does not need a saponifier or any other chemical agent to remove water soluble (OA) flux residues. However, one must conside
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Jun 24 19:14:44 EDT 1999 | Mike Konrad
Very good questions Bob� Given the fact that my company is a manufacturer of batch cleaning equipment, I will speak more in general terms rather than in specific terms. There are several criteria used in the evaluation of batch aqueous cleaning sys
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Tue Jan 05 20:29:32 EST 1999 | Steve Gregory
| A question for you all! | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20
Electronics Forum | Wed Jan 06 09:55:22 EST 1999 | Chrys
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
