Electronics Forum: number and of and rework and repair (Page 1 of 1)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top


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