Electronics Forum: nxt and flip (Page 1 of 5)

Conductive Adhesives and flip chip

Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef

Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

Difference between NXT2 and NXT3

Electronics Forum | Mon Jan 11 22:24:57 EST 2016 | sophyluo1985

Hello, i just know the the speed of NXT3 is faster than NXT 2. Best Regards, Sophy

CSP and underfill

Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C

Wave flux and profiling

Electronics Forum | Wed Dec 20 12:52:18 EST 2006 | pr

Been known to dice a flip or 2. (and we're playing in 70 degree weather)!

Difference between NXT2 and NXT3

Electronics Forum | Thu Mar 10 22:55:27 EST 2016 | annabella

Hello we have lots of smt nxt feeder on sale. Any interested in pls contact with me : 129@yanglingdg.com Thank you!!

High-end SPI and AOI?

Electronics Forum | Tue Oct 13 08:09:53 EDT 2009 | kudamarani08

Can anyone help me recommend or simulate a SPI and AOI machine that can balance our FUJI NXT 1 with 14 modules. We are using MPM accela printer. 200 UPH is our target. Here's the PCB dimension length(x) = 399.92mm width(y) = 141.626mm Thanks all!

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

High-end SPI and AOI?

Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany

Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >

tape and reel machine

Electronics Forum | Tue Oct 09 14:10:24 EDT 2001 | cal

I am confused. You are using pressure sensitive tape. the pessure sensitive tape i have seen does not use cover tape.The pressure sensitive tape I am familiar with is called "Surftape" could you provide some more clarification?? Surftape is more co

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