Electronics Forum | Mon Jun 12 21:16:41 EDT 2017 | kahrpr
you can not just take the motor off and change it. the motors have a home pulse singnial. the motor has to be in a certian position the home pulse position when the flag hits the sensor. When you remove the motor you have to mark the motor gear when
Electronics Forum | Tue Jul 04 14:50:52 EDT 2017 | dleeper
Thanks! good stuff. I am disappointed the IPC has put off updating QFN solder filet specs till rev H. It's a pet peeve of mine trying to argue with customers that a visible toe filet on a QFN is not necessary, and may not even be possible depending
Electronics Forum | Fri Aug 04 11:13:34 EDT 2017 | tombstonesmt
One tip that I found very useful in this application that hasn't been mentioned is auto pick up position teach. Our Panasonic equipment will constantly move the pick up position in regards to the center of the nozzle when scanned. On older Panasonic
Electronics Forum | Mon Oct 09 13:41:20 EDT 2017 | dleeper
developing a reflow profile is about balancing two variables, time and temperature. If its too hot, you damage parts, if its too cold, the solder won't melt. If the belt speed (time) is to rapid your temperatures will ramp to fast, if its too slow, y
Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1
Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send
Electronics Forum | Wed Feb 14 16:00:50 EST 2018 | cbart
We have used it,, mixed results, cleans well, but can as you would imagine destroy plastic, i've had operators soak product and that caused problems, it also destroys any marking labels. we also use different Saponifiers to remove residues in the pas
Electronics Forum | Sun Dec 17 22:23:46 EST 2017 | jmelson
Well, I fixed it. I had resisted taking the motor off because of the recalibrations that would be required. But, it got bad enough I had to. Under the microscope, I could see copper dust packed between the commutator segments. I removed that, and
Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto
I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get
Electronics Forum | Thu Feb 01 15:36:42 EST 2018 | davef
Not to be repetitious, I just don't remember if this has been said or not, I'm old, give me a break. Some people have found that DI water is too thick to properly remove flux residue under low stand-off components.
Electronics Forum | Wed Feb 14 15:30:50 EST 2018 | cbart
In my experience we usually cover this via our internal ECN/ECO process. the document (hard copy or electronic) Would circulate to all respective groups and processes completed and signed off. sometimes it gets handled in two stages, ECN, then a pre-
