Electronics Forum | Thu Jul 20 16:23:08 EDT 2000 | Bob Willis
We set up and ran this process at Nepcon UK with some success but we used a UV adhesive less than 10sec cure so no heat. Push off force for the biggest parts was over 800 grams. We have had to modify the design rules a little to make it work but it
Electronics Forum | Tue Jun 06 13:02:44 EDT 2000 | eott
Charles, I am senior engineer in the environmental test lab for Agilent Technologies(HP Spin off). I am working on qualifying a large SCI(Solder Collumn Interposer) CBGA package. The package is 1mm pitch. The balls are .72mm. The number of balls ar
Electronics Forum | Fri May 04 12:28:12 EDT 2001 | slthomas
We have had some success printing 20mil pitch with our IIT Proframe. It takes some babysitting, and you don't want your operators to be changing these things out every hour or you'll be buying lots of them. Pulling tension in one direction gives r
Electronics Forum | Thu May 10 13:58:26 EDT 2001 | tomgervascio
It sounds like 3D imaging is much better at fault detection for partially visible leads like SOJ packages. Can any of the 2D systems actually do a solderjoint inspection on the outer rows of BGAs or is the angle too acute to accurately look at these.
Electronics Forum | Mon May 14 08:41:11 EDT 2001 | jackofalltrades
Howdy, This subject may be a little off subject, but I have been looking for a source that can give me info for the recommended torque on hardware. What I would love to see, is a chart that can show me, for example a column for the screw size (SAE &
Electronics Forum | Mon May 21 21:31:08 EDT 2001 | Dean
I would like to hear from all Philips Sapphire users about your successes and failures when placing 0402 parts. 1. Are you using type 51 / 57 nozzles? 2. Special vacuum check? 3. How are you calibrating your vacuum sensors? 4. Have you expe
Electronics Forum | Wed May 30 20:39:02 EDT 2001 | davef
Everyone has different needs. We all make trade-offs on costs versus benefits. So, you should determine the value and functionality of the Forums by participating in the current threads, scanning archived threads for pertinence and appropriateness
Electronics Forum | Mon Jun 04 20:55:55 EDT 2001 | craigj
Have been having problems with the above IC but dont know why. Our profile is well within the manufacuters recommendations. We are getting a higher than desired first off fail rate and are concerned. It is not possible to inspect the soldering as the
Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon
PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w
Electronics Forum | Thu Jun 07 07:11:41 EDT 2001 | stefwitt
8" ). For calculation of the theta angle, the global fiducials should be placed over the diagonal. Component recognition can be improved if your vision system has different light zones. The steep light should be turned off and the flat light turned
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