Electronics Forum | Tue Mar 30 02:58:55 EST 2004 | Grant Petty
Hi, Thanks for the ideas. With the solder mask curing problems, can you normally wipe off the white residue, as we can do this on our boards with our fingers. It's almost like the surface of the board has a "wet dried up" look to it, and it's a smok
Electronics Forum | Tue Mar 22 03:23:10 EST 2005 | EA
Hi, We are trying to break a component ( SMT component ) off the printed circuit board and measure the quality of the solder joint. But, after breaking off and having the reading, we do not know whether the reading is it within the component specifi
Electronics Forum | Wed Apr 13 18:28:21 EDT 2005 | RT
We have a situation where our customer returned a device (BGA) with a missing solder ball. The process is Copper-Nickel-Gold-Solderball. EDX revealed that no trace of gold nor solder material (lead-free balls). Could poor Au plating/adhesion cause
Electronics Forum | Wed Jun 08 13:06:36 EDT 2005 | jimby
You will have to machine the part off down to the top of the balls. Wick solder off from individual sites one at a time. All that will be left is Parylene shell where balls once were. Take an orangestick and alcohol to break up and remove. Tricky par
Electronics Forum | Tue Aug 30 17:02:16 EDT 2005 | stepheniii
Check them before the oven for cracks. (after placement) Don't just look at them, take them off the board and check. I"ve seen resisters that were broken by the machine but you couldn't tell untill you took them off. If they are cracked check the co
Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev
Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter
Electronics Forum | Sun Dec 11 08:13:27 EST 2005 | stepheniii
If you are taking off the old BGA then the board finish is not the same as it was orginally. I would want to clean the pads off as much as possible and then use sticky flux with the new BGA. But on the other hand, Aim solder has an article about smal
Electronics Forum | Thu Jun 08 03:40:32 EDT 2006 | aj
Hi, I use convection reflow and both top & bottom settings are the same. Is the part too heavy to rely on surface tension? there is an equation that can determine this (aswell as real test i.e. part falling off) We have some SIM Card holders on bot
Electronics Forum | Tue Aug 22 10:51:49 EDT 2006 | rmitchell
Hi, Hope your machine is back up and running. Are you sure it is not program or PD (part library) related? Try power off and back on and delete the machine program from the machine. Then- Power off and back on and see if the VP error is gone. It
Electronics Forum | Wed Oct 11 15:40:34 EDT 2006 | Steve Gregory
Don't think there's any easy way to clean under a LCC, but you might want to consider this: http://www.winslowautomation.com/ccmd.asp A dead simple way to mount solder columns onto LCC's and then solder the part to the PCB with a stand-off of abou
