Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach
| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in
Electronics Forum | Tue Mar 10 16:11:16 EST 1998 | Mike
| Hello, | I know nobody asked, but here are my 2cents on the newer, more comercialized layout of the forum. | I frequent many of the SMT/Assembly forums and the ones I prefer to stay with are the ones that are NOT comercially oriented. | Not having
Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F
| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Wed Jan 28 19:39:08 EST 1998 | Steve Gregory
| | What is the lifetime for a typical solder paste ? | | How long can boards be stacked waiting before the paste goes off ? | Lifetime and tack time depends on: | - Manufacturer | - Flux/mixture | - Environmental conditions | Typical lifetime is dep
Electronics Forum | Mon Jan 05 16:07:21 EST 1998 | Terry Burnette
| | Hello all, | | I have experienced broken ceramic SMT parts. Most of the time, | | we have found fractured inductive beads. Once in awhile, we find | | broken Ceramic Caps. All parts we use are 1206 form factors and | | we use tape and reel...
Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman
Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found
Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef
It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard
