Electronics Forum: off (Page 6 of 542)

BGA dropping off the board

Electronics Forum | Fri Feb 15 06:21:34 EST 2008 | marjorie

Thanks for the comments and advice. The rest of the components have good solderability except for the BGA that fell off. Our production is high mix low volume so the quantity was very small. I'll check the pcb lands next time I run. It could be a con

BGA Detached off the board

Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg

We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa

Components jumping off the board

Electronics Forum | Sun Jul 13 10:33:08 EDT 2008 | mpolak

Hello, Recently I have change our profiles. After I profile one board it look really good, within the paste spec. But I have noticed when board leaves the reflow zone and enters the cooling zone it looks like popcorn effect some components jumping o

cleaning glue off of stencils

Electronics Forum | Fri Mar 03 13:41:43 EST 2000 | pr

Is it o.k. to clean my glue stencils in the same IPA stencil cleaner I use for solder paste? Also if anyone with experience in stenciling glue can lead me away from first time pitfalls I would appreciate that as well. thanks in advance

cleaning glue off of stencils

Electronics Forum | Fri Mar 03 13:41:43 EST 2000 | pr

Is it o.k. to clean my glue stencils in the same IPA stencil cleaner I use for solder paste? Also if anyone with experience in stenciling glue can lead me away from first time pitfalls I would appreciate that as well. thanks in advance

parts popping off during reflow

Electronics Forum | Thu Sep 13 13:34:49 EDT 2001 | Dave G

Too much Convection Airflow in the Reflow Oven blowing parts around ? Moisture Contaminated Parts out gassing ? Board out gassing? Just some thoughts, DG

parts popping off during reflow

Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar

please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads

parts popping off during reflow

Electronics Forum | Thu Sep 27 21:19:56 EDT 2001 | stimpy

>> try a linear ramp to allow the entire pcb to heat up evenly. What is your conveyor speed?

Board take off on Heller

Electronics Forum | Thu Dec 29 17:21:05 EST 2005 | Larry

We have a Heller 1500W Reflow oven and need a way to catch boards as they come out of the oven. Does anyone have a suggestion as to how to do this. Your reply will be appreciated.

BGA dropping off the board

Electronics Forum | Thu Feb 14 08:14:12 EST 2008 | davef

Questions are: * Do the BGA pads on the board take solder when you solder them by hand? * What is the temperature on the BGA pads during reflow? * What is the temperature on the other component pads during reflow?


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