Electronics Forum: ones (Page 711 of 1373)

Solder paste in Syringe vs Jar

Electronics Forum | Thu Nov 07 04:24:24 EST 2002 | Yngwie

Thanks for the reply guys...It was much appreciated. On syringe or Cartridge - what about the impact of flux migration, there was a talk about, periodically we need to turn the cartridge or syringe upside down to ensure the metal content & flux are a

Components

Electronics Forum | Tue Nov 19 14:58:26 EST 2002 | caldon

HEy all- We are in need of components. Chips, ICs, QFPs, BGA, SOIC, and so on. Does not matter the configuration, style, package. Stick, Tape, Matrix, Tray,Bulk. Typically should be "virgin" not used. And we would like these for a low price...FREE.

Storage Equipment

Electronics Forum | Mon Nov 25 02:28:08 EST 2002 | kenbliss

Hi Ben There are many sources for storage equipment related to SMT assembly. Bliss Industries offers one of the most complete lines anywhere and sells factory direct. We have a detailed website http://www.blissindustries.com that includes Bliss Un

Expired Loctite

Electronics Forum | Mon Dec 02 13:55:49 EST 2002 | stepheno

Where I worked we used a different chip bonder. When we had trouble with flux entrapment in the epoxy from the wave solder, we checked the date of the epoxy. The tube didn't have one but the manufacturer gave a shelf life of 6 months and then the s

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 17 13:42:04 EST 2002 | robf

There are a few emerging technologies that have been growing in popularity for the past few years. Pin through paste, press fit connectors and selective soldering machines seem to be displacing custom fixtures. Most of the mixed technology boards o

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Thu Dec 05 17:40:24 EST 2002 | davef

While unfamiliar with some of the terms you use, could this be what you seek? http://www.pcbstandards.com/downloads/Metric%20Environment/General%20Documentation/PCB%20Design/PCB%20Design%20Routing/Metric%20BGA%20Routing.pdf Stepping backwards just

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Mon Dec 09 21:15:27 EST 2002 | MA/NY DDave

Hi I haven't looked yet at what DaveF gave you. It is my guess that your SJR stands for Solder Joint Reliability. The answer would in general be NO to your question. Usually things in the design community are done in steps that provide a certain

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Mon Dec 09 20:50:08 EST 2002 | MA/NY DDave

Hi I kind of agree without any reliability studies. Where are the Ionics coming from? After Soldering depending on chemistry I think we agree? Yet these are bare boards after many processes and even testing that should scrub out or off the Ionics.

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Tue Dec 10 18:30:15 EST 2002 | MikeF

From personal experience, if the PWB vendor is cutting costs and doing their final rinse with tap water instead of DI you will get ionic contaminants left on the board. You might consider having CSL, or one of the other independent labs mentioned e

Zevatech 720

Electronics Forum | Thu Dec 12 00:36:11 EST 2002 | Frank

We had one of these years ago. We had trouble with it recognizing fiducials consistently, but other than that it ran good. This assumes that the left head, which is mechanical centering, is working good. And I believe that the minimum component


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