Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Sat Feb 03 10:51:47 EST 2007 | Sami
Hello to all. I have faced with a strange problem with Universal machine GSM Genesis, After an 8 hours of production without a Stop then, the M/C starts displaying components non aailable for many feeders in the same feeder bank! eventhough the feede
Electronics Forum | Thu Mar 01 23:30:56 EST 2007 | jmelson
I am having second thoughts, because this machine is not an 84VZ. That's the one I would prefer. But, it is still at $520 on eBay! Arrghhhh! Well, in a little over a day I will know one way or the other. Thanks for the info on the equivalent Yam
Electronics Forum | Tue Mar 06 15:59:33 EST 2007 | pima
hello I would like to ask you for advise. I have problem with one of my SMT line and skewed parts at the end of line after reflow. My line is composed: DEK, 3d visual inspection of paste printing, IP3, 8 zones reflow oven. I m builidng there produc
Electronics Forum | Tue Mar 27 09:21:45 EDT 2007 | realchunks
Hi Donovan, I guess it really depends on the product, how it's built and how you'd stress test it. Many arguments can be made about how far to test, then when one fails in the field was it due to manufacturing or test? But the bottom line is most
Electronics Forum | Fri Mar 30 14:14:28 EDT 2007 | jaimebc
"This is how I rate changeover time capability (includes PCBA first article): Greater than one hour: improvement needed, competitive disadvantage Approximately one hour: good, about average for the industry Approximately 30 minutes: very good, clo
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Tue Apr 03 20:46:32 EDT 2007 | Mike Konrad
We manufacture similar equipment. I would recommend that most of the testing be performed in an automatic shut-off mode. There are potential issues with both methods, automatic shut-off and fixed time tests. In an automatic shut-off mode, the cl
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
