Electronics Forum: opens (Page 1 of 208)

BGA opens

Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks

Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So

BGA opens

Electronics Forum | Mon Nov 09 16:05:29 EST 2009 | sawyer

Hi, i have a big problem with a BGA, and i have no idea where could be the broblem because eveything seems to be ok(printing, placement, reflow). I have arroud 2-3% Opens from the quantity of boards produced during a shift. Can enybody help me with s

BGA opens

Electronics Forum | Wed Jan 24 10:26:35 EST 2007 | Phlip Kid

CMs suck!

BGA opens

Electronics Forum | Wed Feb 21 15:35:22 EST 2007 | wavemasterlarry

BGA open? Isn't some golf outing? Can't wait for the golf season so all the engineers here go away.

BGA opens

Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp

Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a

BGA opens

Electronics Forum | Thu Feb 08 13:57:50 EST 2007 | Ignorant

Hi SOB, Can you please amplify each of your points - what limits do you recommend. Yours, Very Ignorant

BGA opens

Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne

I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA

BGA opens

Electronics Forum | Wed May 02 06:56:52 EDT 2007 | Rob

Has anyone experienced deformed balls on BGAs - especially very low volume build to order devices? I'm looking into a possible hidden pillow defect and think I have eliminated most of the other factors I believe could cause it. Cheers, Rob.

BGA opens

Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose

Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.

BGA opens

Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie

to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy

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