Industry Directory | Consultant / Service Provider / Manufacturer
Unique "Free to use" Software that optimises the efficiency & quality of Prototype PCB assembly & inspection, significantly reducing overall cost & increasing customer productivity, capacity & profitability.
GROW YOUR BUSINESS WITH YOUR VERY OWN PART TIME OUTSOURCED CFO
DEK Horizon 02i Automatic Screen Printer Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimised Printer Frame common to all Horizon machines Accept
New Equipment | Selective Soldering
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
Electronics Forum | Wed Jan 12 09:19:06 EST 2005 | Scott B
If you go into 'Magazine' menu and select 'Hydra preparation' then select the layout you wish to optimise (thats the stinger, you can only optimise for a single layout). You will then be presented with optimisation options which can be adjusted ('sa
Electronics Forum | Mon Mar 15 11:30:11 EST 1999 | af ng
Is there anyone know where to get information on PIck & Place equipment Program optimisation ( to improve the speed of component placement for boards). Thank you
Used SMT Equipment | Screen Printers
DEK Horizon 02i Automatic Screen Printer Dek Horizon 02 Specifications: Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimi
Used SMT Equipment | Screen Printers
HORIZON 02i Approx. Weight 820kg boxed 677kg unboxed Approx. Dimensions 2060mm x 1500mm x 1570mm (81.1” x 59” x 61.8”) Accuracy and Repeatability 1.6 Cpk @ +/- 25 m Cycle Core Time 12 seconds Max. Board Size (Print Area) 508mm (X) x 508mm (Y)
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Parts & Supplies | Screen Printers
Euroamp 10 card DC servo motor drive (OPTIMISED CONTROL LTD BRISTOL)
Technical Library | 2008-02-20 21:42:52.0
Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
Atom is the new flagship Europlacer pick & place platform. While it sits at the top of our range, it is complementary to and compatible with all our other platforms. That’s what Europlacer customers have come to expect. And Atom continues to deliver
Events Calendar | Fri Oct 06 00:00:00 EDT 2023 - Fri Oct 06 00:00:00 EDT 2023 | Monterrey, Mexico
Mexico Technology Day 2023 - ViTrox's Tech Insights & Product Demo
Career Center | Anaheim, USA | Engineering
General Manager & VP, PG Drives Technology, Inc Company Outline PG Drives Inc is the North American sales, service and distribution subsidiary of PG Drives Ltd, a leading global designer and manufacturer of sophisticated electronic motor control s
Career Center | County Durham, United Kingdom | Engineering
I am currently working on behalf of a Global Leader in Automotive Safety Systems based in the County Durham area of the UK. They are currently seeking to recruit an SMT Engineer whose main duties and responsibilities will compromise of the following
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
Placement Optimisation in a Lean Manufacturing Environment Placement Optimisation in a Lean Manufacturing Environment Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce
