Electronics Forum | Mon Jun 26 08:57:17 EDT 2017 | capse
If N2 is not an option, the cut wire feeder or drilled wire are your best bet for now. You need to optimize wire feed rate as well. The solder joint on the robot takes about the same time to form as in manual soldering. If you need to speed the solde
Electronics Forum | Mon Apr 09 15:02:00 EDT 2018 | rodrigo
Hi all, Does anyone know the "preferred" PC setup to install F4G? We have several PCs but it only fully works on an old celeron PC that is extremely slow. In most other either the CP6 optimizer or CAD converter do not work. We have 2 lines with the s
Electronics Forum | Sun May 27 22:36:25 EDT 2018 | fadzril
Hi! I would like to inquire if anyone occurred the following error for Sony SI-G200? Error : The upper pusher return sensor is not on. Alarm Code : 410000607 Recovery Method : Re-optimize the program There's a grey area between machine & program.
Electronics Forum | Tue Oct 30 11:47:49 EDT 2018 | emeto
The speed of the line is really not your machine spec on the brochure. You can produce so much more boards with stable reliable equipment and optimized process than you can do with the fastest machine out there. I have seen super fast lines stopping
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Tue Dec 31 17:05:20 EST 2019 | slthomas
Assuming you've already looked at optimizing your profile and stencil design, have you looked at metal load in the paste? I hadn't, but just read that increased metal load (associated with reduced powder size, i.e., moving from T3 to T4) has been sh
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Tue Sep 22 14:33:41 EDT 2020 | majdi4
Thank you @Makersan CO for your input . Am still doing research for a best tool choice.. I want to avoid pneumatic supports because i had bad experiences with it..am looking for magnetic base supports involved in a dynamic movement block .. or someth
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