Electronics Forum: original pin error (Page 21 of 26)

Re: PHILIPS FCM II

Electronics Forum | Wed Aug 04 01:03:16 EDT 1999 | Dean

| | | | HI EVERYONE, | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | | | | WHAT

Re: PHILIPS FCM II

Electronics Forum | Thu Aug 05 03:20:16 EDT 1999 | KEVIN SIMPSON

| | | | | HI EVERYONE, | | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | |

Re: DPM-Rate for SMT pprocess

Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer

| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi

Re: DPM-Rate for SMT pprocess

Electronics Forum | Thu Oct 08 22:06:44 EDT 1998 | Eric R

| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi

Re: unsoldered joints

Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys

| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen

UP1500 Frame Sizes?

Electronics Forum | Mon May 02 18:54:28 EDT 2005 | MikeaJ

The answer you are looking for is part of your initial setup of the board and stencil. This information is to be found in the PCB setup menu/icon. The reason why the stencil loading pins are impacting the frame is because the default setting of the s

Gel Flex Support

Electronics Forum | Thu Nov 03 14:43:19 EST 2005 | chunks

Hmmmm.... We never had to change any parameters when switching over to Gels. And no, we don't let the operators have kitty-wampus on our programs either. The Gels did get rid of broken parts. We have Run Orders of about 50 pieces. We change over

Can someone help me on correcting CAD information on Univesal mc

Electronics Forum | Mon Jan 29 08:18:48 EST 2007 | mika

Hi Sami, A little more detailed information would be good,as it perhaps makes it easier for us to point you in the right direction of the root cause of your problem. And then you should fix that, rather than tweaking your programs around. 1. What typ

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Re: reflow/cure/wave for double side assembly

Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam

| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run


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