Industry Directory | Manufacturer
PCB maker in Penang. 2-14 layers PCB. HASL, ENIG, OSP. ImmAg. george.lim@elnapcb.com
Industry Directory | Manufacturer
PCB manufacturer. 2, 4, 6, 8 layers PCB. HASL, ENIG, OSP.
Project Description | Parameters 4 Layer Thickness: 1.2+/-0.12 mm Min Hole Size: 0.3 mm Width/Space: 0.12mm/0.12 mm Surface Treatment: ENIG | Craft Red Ink ENIG+OSP | Application Consumer Electronics
New Equipment | Fabrication Services
Minimum line width/space: 5mils Surface finish: OSP Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Electronics Forum | Wed Dec 20 15:21:06 EST 2000 | OS
How should OSP PCB be handled, when stored; and during manufactruing process on production floor?
Electronics Forum | Wed Jan 21 05:01:10 EST 2004 | sd
Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.
Used SMT Equipment | THT Equipment
Model VC-5080R Radial lead er OSP-4000 Machine Controller Desktop Computer Console 60 Feeder Positions (expandable to 80 Positions). Ammo-pak or Tape'N'Reel 450mm X 330mm ion Area, (18" X 13") 2.5mm AND 5mm Lead Span (.100" & .200"),"G-Guide) Outward
Used SMT Equipment | THT Equipment
Model VC-5080R OSP-4000 Machine Controller Desktop Computer Console 60 Feeder Positions (expandable to 80 Positions). Ammo-pak or Tape'N'Reel 450mm X 330mm ion Area, (18" X 13") 2.5mm AND 5mm Lead Span (.100" & .200"),"G-Guide) Outward cut & clinch +
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Parts & Supplies | Circuit Board Assembly Products
1). Material: CEM-1/CEM-3, 2). Single sided, 1.6mm material 3). 1 oz copper finished 4). Green solder mask/white silkscreen letter 5). OSP surface finish 6). Punched contour
Parts & Supplies | Circuit Board Assembly Products
1). PCB prototypes to small volume. 2). Standard FR-4, 0.3-5mm thick, 1-5 oz 3). 1-30 Lalyer 4). MOQ 1 PCS 5). 4 days delivery 6). HASL, ENIG, OSP etc finish
Technical Library | 2023-01-06 16:18:23.0
PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.
Technical Library | 1999-08-09 11:09:42.0
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
●Board : FR-4 ●Surface treatment : OSP ●#of tests : 900times ●Probe pressure : 3.0N ●Probe shape : Crown and Straight
