Electronics Forum | Wed Dec 20 15:21:06 EST 2000 | OS
How should OSP PCB be handled, when stored; and during manufactruing process on production floor?
Electronics Forum | Wed Jan 21 05:01:10 EST 2004 | sd
Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.
Electronics Forum | Wed Jan 21 09:36:52 EST 2004 | davef
As with noclean flux, OSP will fill your probes with crunchy [maybe gummy] stuff. Consider: * Increasing frequency of probe maintenance * Talking to your probe supplier about alternate probes that self-clean better
Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.
Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris
Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks
Electronics Forum | Thu Jan 22 08:48:42 EST 2004 | patrickbruneel
Kris, You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www
Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F
Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst
.gif)
