Electronics Forum: osp and acronym (Page 1 of 4)


Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend

We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib

pcb purchasing and pcb assembly

Electronics Forum | Thu Mar 19 12:26:10 EDT 2020 | yuaanliie

You have mostly set in your mind before purchasing PCB i.e. PCB is an acronym for the printed circuit board. Last month I purchased PCB from Great PCB.


Electronics Forum | Thu Aug 22 22:07:44 EDT 2002 | davef

Did the techs have a restful night?


Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend

Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu


Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Re: Ionic testing and No-Clean flux

Electronics Forum | Mon Feb 07 12:42:25 EST 2000 | Brian E. Steelglove

Graham, Please describe the term OA? I have never heard of that acronym. Thanks, Brian E. Steelglove

Re: BGA and PCB finishing

Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker

Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.

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