Electronics Forum | Tue Mar 25 08:29:33 EDT 2014 | sara_pcb
Please refer the attached jpegs, The problem is noticed after reflow soldering followed by conventional through hole soldering. Flux used one is MIL Std. Brush cleaning in IPA is followed after each soldering step. regards, R.Saravanan
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost
that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
