Electronics Forum: osp ict (Page 1 of 3)

osp finish

Electronics Forum | Wed Jan 21 05:01:10 EST 2004 | sd

Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram

We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:58:44 EDT 2019 | SMTA-Vikram

Thanks for info regarding rotating probe head. We do not recommending to use this probes as it may damage bare board as it will pierce thru board and will shorted etches.. Avoid using this probe for PWBA

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Jun 07 05:19:23 EDT 2019 | gregoryyork

dont usually see this unless the Rosin hasnt been hardened due to low reflow or excessive pressure on blades squeezing flux out so you have flux rich areas. Are these boards also flow soldered?

ATE/ICT testing of OSP test points

Electronics Forum | Fri Aug 20 00:11:05 EDT 1999 | Rick Holmes

Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads.

Re: ATE/ICT testing of OSP test points

Electronics Forum | Fri Aug 20 05:17:25 EDT 1999 | Earl Moon

Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads. Think rotary. Earl Moon

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram

3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram

Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl

Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer

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