Electronics Forum: osp time to use (Page 1 of 32)

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 14:32:49 EDT 1999 | John Thorup

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 14:29:48 EDT 1999 | Doug Philbrick

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 13:50:24 EDT 1999 | Jose RG

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with o

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi

Re: Nitrogen to use or not to use

Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra

At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and

Re: Nitrogen to use or not to use

Electronics Forum | Tue Dec 21 08:33:54 EST 1999 | Nancy V

Luis, Go to the library on SMTnet and you will see Standard and Terms. Select that and you will be able to download the terms and definitions for SMT assembly. It is very useful. Of the terms you requested, only FPY is not there. I was curious a

Re: Nitrogen to use or not to use

Electronics Forum | Thu Dec 16 17:50:03 EST 1999 | LUIS LOPEZ

Hi, I am new on this, I want to ask you what is HASL finish, OSP, FPY, ppm. About to eliminate the Nitrogen in reflow soldering, a listen about one solder paste that no requires Nitrogen, the solder paste is called Indium, I don't know if this is tru

What to use SAC305 or SAC405??

Electronics Forum | Tue Apr 17 02:01:12 EDT 2007 | Wayne

Yes, all the leadfree solders are currently for consumer products. Military and aerospace industry haven't implemented leadfree yet. They are still study which to go! Maybe that time, we all can follow military std and having high reliability product

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