Electronics Forum | Fri Feb 23 17:35:49 EST 2001 | mattias
Ok. F.Y.I How I could make this work: We use Almit V14, and SMT ovens. You can say that we don�t do our maintenance as good as we should. Our Smt Quattro peaks are equipped with process gas cleaning (wich works quite good actually) I ripped out the
Electronics Forum | Wed Mar 07 20:43:55 EST 2001 | davef
Sure, the rolling action of the paste creates a weak magnetic field surrounding the paste. This is similar the field created by electric current flowing through a wire, as first described by James Maxwell. After creation of the magnetic flux, the m
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Fri Mar 16 11:52:31 EST 2001 | J.D. of Panasonic
Ed, You certainly are ready for some equipment. I noticed in your message that you mentioned cost three times. So it is a very big issue to you. What everything depends on is where you see your company going in the next few years. Do you want
Electronics Forum | Wed Mar 28 15:47:06 EST 2001 | kerryn
Mike, I see that you are from Aqueous Technologies and you sell stencil cleaners. I now understand your sensitivity to this subject. I seriously doubt that the EPA would copy you on correspondence between the EPA and another company. If they did,
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef
OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because
Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
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