Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Mon May 06 08:25:35 EDT 2002 | ianchan
check http://www.metcal.com inquiry the metcal team on the APR5000. no package is too much fuss nor mess with this system that rocks the house, and comes it with a price tag affordable to most companies. the only -ve limitation this system may ha
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Thu May 09 12:29:59 EDT 2002 | dougt
So after barcoding takes place, is this info sent to the feeder or the outside world (is the feeder just a number that the pick and place machine looks for or does the feeder tell the machine what it has)? I guess if every machine and remote feeder f
Electronics Forum | Tue May 14 15:49:30 EDT 2002 | dason_c
Thank! Francois. I think that I also had a paper from Lucent, Handling of Highly-Moisture Sensitive Components. Is it the one which you mention above? I just would like to figure out. Per Desiccant type dry box, it claim that it can absorb the m
Electronics Forum | Fri May 24 17:37:58 EDT 2002 | fastek
Seems like the landscape is changing in SMT equipment for US manufacturers. I have heard the following but I don't claim they are anything more than rumors: 1) Sanyo and Universal are parting ways and Sanyo will market their machines in the US direc
Electronics Forum | Wed May 29 00:28:11 EDT 2002 | alex_kirichenko
Hi Ben! I was in your position just over 12 months ago.. We use round appetures for BGAs and don't have any problems with it, as long as thiknes of your stencil is correct. As for baking BGAs befor placing. I haven't had any problems with devices
Electronics Forum | Wed May 29 12:41:46 EDT 2002 | peterson
I'm out here on the leftcoast. Actually, our method for removal is: break down the sides, pull each pin individually. It's tedious and time consuming, but it can be accomplished with little risk of damaging the board. Customers are curious, however.
Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob
No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe
