Electronics Forum | Wed Jun 03 19:07:03 EDT 1998 | Steve Gregory
| | | | | | | | | | Hi there...I'm testing....is anybody else having problems posting messages?....this is a test... | | | | | | | | OOPS! I guess it's working now...hmmmmm... | | | Steve: Stop!!! Breath deeply. Good. Now is there anything you
Electronics Forum | Wed Jun 03 10:25:49 EDT 1998 | Justin Medernach
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Tue Jun 02 12:58:07 EDT 1998 | Michael Allen
"...the part is aligned to the pads with in 10% before going into the IR oven." Sounds like the pad pitch might be okay (?). If that's not the problem, then what? I wish I had the answer, because I've struggled with heavy QFPs for some time now (2
Electronics Forum | Thu May 28 22:49:32 EDT 1998 | D. Lange
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
Electronics Forum | Fri May 22 07:59:14 EDT 1998 | Jerry
We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision syste
Electronics Forum | Thu May 28 18:16:40 EDT 1998 | Ian Bates
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Thu May 21 22:07:47 EDT 1998 | Mike Konrad
I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to exce
Electronics Forum | Fri May 22 22:13:27 EDT 1998 | G. Henning
Thanks for the advice. We are experiencing only limited success with SMT on the drag. Problems are indeed bridging and misses on the smaller discretes. Works well on PTH as long as the pitch is not too tight. I'll have to justify a new machine. Rega
Electronics Forum | Thu May 21 22:20:18 EDT 1998 | Earl Moon
| I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to ex
