Electronics Forum: out (Page 96 of 1200)

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:18:05 EDT 2006 | C.K. the Flip

The main cause of voids is your flux out-gassing during reflow. Try a little "knee" or slight soak in your thermal profile to dry out the volatiles a bit. Typical soak ranges from 130 deg. C to 170 deg. C for around 30-90 seconds.

Dek MK1

Electronics Forum | Sat Oct 21 03:02:02 EDT 2006 | aj

All, We had a power cut the today. Machine times out on Actuators and Paste Dispenser hence it will not Initialise fully. I have traced back each related card but all seem to check out fine. Next step is PSU (looks awkward to access) Any ideas fe

IR zone vs forced convection

Electronics Forum | Mon Oct 30 09:43:31 EST 2006 | russ

Are your preheaters maxed out then? What is conveyor speed? anyway I would not have issue with that configuration at all. I have actually found that when using convection for some watersolubles you actually dry out flux and performance is worse.

Lead Free paste

Electronics Forum | Tue Nov 07 15:08:59 EST 2006 | russ

here are my thoughts on kester, I have rec'd a sample to qualify here and we cannot even get it out of the cartridge it is so dryed out. Rep informed me that Kester has a problem with its chemistry right now. Product is Mfgr'd in off shore location

Chinese Wave Solder Machines

Electronics Forum | Tue Nov 28 16:05:29 EST 2006 | Steve

Well said. From my experience, the Chinese would ship out of spec. product knowing full well it does not meet the requirement. If we catch it, good for us . . . otherwise we are #@%$%#. The Japanese (and others) on the other hand would rather pull

Paste Batch Control

Electronics Forum | Fri Nov 24 06:59:54 EST 2006 | LM

I remember many moons ago seeing a refridgerator for storing solder paste which issued them out in a FIFO manner and had the option of a PC and bar code scanner for logging them in and out to the lines. I can't seem to find any trace of it on the net

Die temperature exceed Tg temperature

Electronics Forum | Tue Dec 19 08:32:44 EST 2006 | davef

Take your choice: * Can't image this is a good thing. The board under the die will 'dry-out' and turn brittle over-time. It's possible the way attachment glue bonds to the board will change as the board dries-out. * Epoxy suppliers pad their number

MPA80 visual correction - How I do it ?

Electronics Forum | Tue Jan 09 08:26:51 EST 2007 | stepheniii

If your boards are not totally rectangular part of the board can stick out past the stopper. If the fiducial is there then you can't use it. Also make sure you are not using panel fiducial co-ordinates and then expanding those out with panelization

manufacture symbols

Electronics Forum | Tue Jan 09 22:16:17 EST 2007 | guest

For chip components it is very hard to identify specially the capacitors. You could get sample of each chip manufacture and compare the color. This is very labor intensive task. I suggest to sort by value ( capacitance, resistance) than by manufac

Problem with shielding component

Electronics Forum | Fri Jan 19 13:31:14 EST 2007 | lit51

Is the failure just out of tolerance or is it non functioning? For tolerance problem, compare the x-rays of the good and bad units. It will take a very high resolution x-ray to spot the differences. Changes in capacitance values can occur based on


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