Electronics Forum: oval (Page 1 of 4)

Stencil design (maybe old) question...

Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t

Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam

Round Solder Lands

Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC

Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac

Snapshot Process

Electronics Forum | Fri Jan 31 05:18:10 EST 2003 | reg

We have a customer who is going to be using the new Snapshot process. Has anyone used this process all ready. Who did you use to make the tooling etc. Was there any problems that arose during this process. The process involves screening balls into s

THT connector solder thieves

Electronics Forum | Thu Feb 13 07:13:39 EST 2003 | davef

Tell us more about the location of the bridging [ie, front-to-back, back-to-back, front-to-front, etc]. Thoughts are: * Your annular ring around the hole seems large. You have 0.007", consider 0.003" to be the minimum. Your board fabricator can gi

TO-220 Chip Package - Bridges

Electronics Forum | Wed Jun 12 12:35:03 EDT 2013 | deanm

Dan, Can you upload a picture of the bridging? Why oval pads? Have you considered using round pads with the smallest practical annular ring? In my opinion, an oval pad would potentially hold more solder because there is more exposed area, and the m

Re: STENCILS

Electronics Forum | Fri Jul 31 17:21:38 EDT 1998 | MMurphy

31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.

Re: STENCILS

Electronics Forum | Fri Jul 31 17:23:11 EDT 1998 | MMurphy

31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.

Re: STENCILS

Electronics Forum | Fri Jul 31 17:24:12 EDT 1998 | MMurphy

31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.

Re: STENCILS

Electronics Forum | Wed Aug 05 07:44:18 EDT 1998 | Joe Vella Ottosen

31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 24 05:25:07 EDT 2007 | mika

Thanks aj, Ohh I wish that there was a way to post a picture in this forum or a possibility to attach the datasheet... Which BTW does not have any recommendation of "how to". This package does not have the "center thermal pad" like a QFN or MLF pack

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