Electronics Forum: ovens (Page 151 of 505)

Info on the Data Paq Reflow Tracker

Electronics Forum | Wed Feb 21 09:01:16 EST 2001 | Donnie

Thanks for the input. We currently have both the Waverider and Kic products in house. We use the WaveRider on all our waves, and the Kic for the ovens. We want to find a product for our ovens that's a little more up to date than the Kic. I'm looking

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss

I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sun Jun 10 12:30:10 EDT 2001 | procon

Is this a Convection Oven or IR? If convection, you can increase the air velocity in the zones if the oven has this ability. You should do as Dave has explained. If you must use pallets when reflowing your components, you need to profile in the same

Question on Reflow Profile Development

Electronics Forum | Thu Jun 14 14:01:11 EDT 2001 | Claude_Couture

I used to associate the mass of the assembly with the reflow profile. The greater the mass, the greater the quantity of heat you need to give the assembly. Most of the time you just need to reduce the speed of travel in the oven. Try different settin

MS Level 6

Electronics Forum | Fri Jun 22 10:54:40 EDT 2001 | davep

The part is a high pin count PBGA with an integrated ceramic heatsink. What I am trying to understand is how to handle this part in production. It seems as though you would have to have an oven very near your SMT line, pulling a few trays of parts

Mid Chip Solder Balls

Electronics Forum | Fri Jan 14 16:21:42 EST 2000 | Dave Chapman

We are having mid chip solder balls on chips and resistors. Seeing the problem on 80% of the assemblies we run. Anywhere from 1 to six of the balls per board. We have slowed the oven down, increased the pressure on the screenprinter to get less paste

D-Pak misalignment Problem

Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss

We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve

Re: Solder Balls

Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F

Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen

Re: ABW Reflow Oven

Electronics Forum | Tue Aug 31 10:45:53 EDT 1999 | Dave F

| Need info on ABW Relow Oven such as manuals, software or contact info technical support. | | Thanks! | Lee: ABW became cash poor and went goooosh!!! about 5 years ago. Manix Manufacturing holds the ABW design rights, manufactures and markets "

oven ventilation requirements

Electronics Forum | Wed Aug 04 14:56:05 EDT 1999 | Brian

We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough tha


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