Electronics Forum: ovens (Page 341 of 505)

Re: BGA Profile

Electronics Forum | Wed Feb 24 14:12:31 EST 1999 | Dave F

| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl

Markers - Pens

Electronics Forum | Fri Feb 19 10:33:16 EST 1999 | Michael Nguyen

I need some help to see if anyone knows of a vendor that makes a permanent marker that is in the Houston area that can write on a PCB the size of a grain of rice using white permanent ink...That's the amount of space we have to write our serial numbe

Alternatives to device bake out

Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers

Cracking solder joints

Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick

I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is

SMT line

Electronics Forum | Wed Jan 20 12:04:44 EST 1999 | DDC

Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. I would like to know a recommende

Windows NT GUI vs. A web browser interface

Electronics Forum | Wed Dec 30 10:57:04 EST 1998 | Steve Evers

Windows NT graphic user interfaces for equipment abound. Companies seem to have standardized on Windows NT for every thing from reflow ovens to pick and place systems. But why? How badly would someone be "bucking the trend" if they manufactured a

Re: Operation userinterface of the machine

Electronics Forum | Tue Nov 10 09:51:53 EST 1998 | Scott McKee

| Some placement machines has WindowsNT userinterface,and | some has another type of userinterface. | Although I think the WindowsNT is better for engineers, | it seems not so friendly for some machine operator. | How much is the WindowsNT important

PCB Stiffeners

Electronics Forum | Mon Nov 02 23:12:13 EST 1998 | Kelly

We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners staying

Re: DPM-Rate for SMT pprocess

Electronics Forum | Tue Oct 06 08:20:13 EDT 1998 | Charles Stringer

| Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium batch

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material


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