Electronics Forum | Tue Mar 04 07:23:15 EST 2003 | msivigny
Hello ricardof, To implement Cpk studies on SMT production equipment, you will require highly accurate glass plates, glass component slugs, accurately manufactured stencils and a measurement system to perform X, Y and Theta positional deviations from
Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi
Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th
Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny
Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur
Electronics Forum | Thu Apr 03 09:08:50 EST 2003 | rdr
Thanks Scott,Iman, The problem has been isolated to detachment from package so I believe that there are no fabrication issues related to the Gold on the PCB. What is a Moyet analisys? where can I find more info? Dave, I am still waiting on Altera t
Electronics Forum | Wed Apr 09 20:05:21 EDT 2003 | davef
Kevin: We know of no handy approach to developing recipes. * Certainly programs provided by profiler suppliers give you a good first pass, based on your oven and solder paste. * Second pass in developing your recipe comes through trail and error chan
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Wed Jun 11 09:59:19 EDT 2003 | jgregory
Hello all, We have came into this problem that I wanted to get everyone's input on from the SMTNET. We have roughly four pieces of equipment from a major manufacturer that we purchased from various brokers. We have two reflow ovens, one wave solder,
Electronics Forum | Wed Jun 11 16:45:09 EDT 2003 | jgregory
I do not agree. We were even told that if we do not pay, and we need to order parts, that there is no guarantee of receiving the right part number (since we didn't/couldn't use phone support for correct part numbers) and if the wrong part was receive
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Tue Aug 05 18:02:05 EDT 2003 | MikeF
Check the areas that are getting solder on the top side. If you have internal ground planes, and the ground plane pth's are not getting solder on top, and signal pth's are, it's a heat problem. If the ground planes are in the middle of the board yo
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