Used SMT Equipment: overheating (Page 1 of 1)

Air-Vac PCBRM System 5.2

Air-Vac PCBRM System 5.2

Used SMT Equipment | Soldering Equipment/Fluxes

Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature

Recon Inc

Air-Vac PCBRM System 5.2

Air-Vac PCBRM System 5.2

Used SMT Equipment | Soldering Equipment/Fluxes

Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature

Recon Inc

Global Active Lead Free Reflow Oven ES series

Global Active Lead Free Reflow Oven ES series

Used SMT Equipment | Soldering - Reflow

E Reflow with mesh belt and pin chain full convection oven In an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum. T

Xtreme Marketing LLP

Hexi lead-free reflow soldering mac

Hexi lead-free reflow soldering mac

Used SMT Equipment | SMT Equipment

Features: 1. Heating system 1.1 Independent heating models are located with top and bottom with single hot air circulation in each zone. 1.2 All the heating zones are controlled by PLC through PLD, 1.3 Each zone is heated step by step, thus reducin

Hexi Electronic Equipment Co.,Ltd

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