Electronics Forum | Thu May 05 17:15:46 EDT 2005 | russ
You got what I think someone has called a "cold melt". If you were to run your removal profile awhile longer you would not see this. Anyway, you don't have any issues as this is very common (at least in my experience). FYI I was thinking your oxid
Electronics Forum | Thu Jun 09 13:54:42 EDT 2005 | ppwlee
I'm curious what other companies are doing in their soldering area (wave/ hand solder/ solder fountain) to ensure thier employees are protected sufficiently against solder fume and lead oxides. Subsequently what it implies in terms of selecting the r
Electronics Forum | Tue Jun 14 11:29:44 EDT 2005 | davef
Check government agencies for recommendations. For instance: http://www.hse.gov.uk/pubns/indg248.pdf Flux flume: Follow the recommendations of your materials suppliers. For instance: http://www.frymetals.com/pdf_uploads/ organicacidcoredsolderwi
Electronics Forum | Fri Nov 11 04:06:46 EST 2005 | arnold
we are manufacturer of molded type transformer. we have a trim and form process and its damage the pins of our units. the TIN insulation was being damage so we decide to immediately solder (wave soldering) the units to avoid oxidation. my question is
Electronics Forum | Mon Feb 19 14:28:35 EST 2007 | John
To: Wave Master Larry, You are correct in one respect. There is always dross on the wave, but it is a result of oxidation of the tin and lead. It IN NO WAY POSITIVELY EFFECTS the solder process, in fact, dross trapped in the solder joint is a detri
Electronics Forum | Thu Jan 19 16:25:03 EST 2006 | solderiron
Any metalurgists out there? I take the resistance value of a metal oxide substrate made of silver or gold or manganese. I then solder with 63/37 and the resistance changes but not dramatically. I then solder with Lead free SAC305 and the resistance c
Electronics Forum | Wed Jun 21 08:53:25 EDT 2006 | stepheniii
Are you worried the terminations might b oxidized? Do a dip test. If you have a solder pot carefully dip one termination of the cap into the solder. And see how well it wets. If that test doesn't satify the powers that be, then you can design a more
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith
Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me
Electronics Forum | Thu Nov 09 23:01:34 EST 2006 | davef
Tin/lead alloys tend to oxidize very easily, affecting solderability. Use the largest particle sized paste possible, because as the particles decrease in size their total surface area per unit mass increases, effecting: * Demands on the flux increase
