Electronics Forum: oxidation (Page 41 of 90)

Reflow soldering of lead-free components with leaded solder paste

Electronics Forum | Mon Feb 26 20:05:09 EST 2024 | alexv

Leaded solder is liquidus at 183C, 220C is max. Sounds to me your boards might be contaminated or the plating is poor and allows oxidation. Without seeing the boards or profile, I recommend you slow down your oven for a longer soak, to allow the acti

Re: Dark Pad / Gold Embrittlement?

Electronics Forum | Thu Jul 27 21:57:16 EDT 2000 | Dave F

Hi Doug: Responding to your questions: � If gold over nickel is self limiting ... You didn�t say whether you gold plating was electroless or immersion. Electroless is not is self limiting. It can plate up to 5 thou. Expect immersion plated gold to

Re: Cleaning Ceramic Substrates

Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach

| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in

Re: Voids in the joints

Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach

| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope

gold connectors

Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli

Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta

Why measure O2 ppm level in N2 environment

Electronics Forum | Wed Mar 05 11:45:04 EST 2003 | msivigny

Hello Yngwie, When we look at the technical benefits of using N2, you'll find that your customer is trying to get a better product. Now as we discuss just a few of the reasons to use N2, when O2 is present in the heating atmosphere it carries oxides

The truth about lead-free and environment

Electronics Forum | Fri Mar 24 11:12:06 EST 2006 | patrickbruneel

You�re a good man Rob and a good patriot, you defend your governments decisions even if they're wrong. Isn't the WEEE directive aimed at preventing electronics ending up in a landfill? This immediately takes away the leaching arguments and is a great

Hidden Pillow Phenomenon

Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef

"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

Nitrogen in the Reflow Oven

Electronics Forum | Mon Oct 14 19:59:17 EDT 2013 | hegemon

We do in fact see a reduction in soldering defects, most especially wetting issues for both parts and PWBs, tombstones, billboards, etc... As a CM we see all kinds of customer furnished material, some of it not in the greatest condition. Our best p


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