Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Thu Jan 15 15:13:50 EST 1998 | justin medernach
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi
DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip
Electronics Forum | Tue Aug 19 09:09:15 EDT 2003 | D Peter
After a few problems and time constraints on baking moisture sensitive devices, we are looking at solutions to storage rather than going after a rebaking solution. One thing that always bothered me about baking was the oxidation on the lead finish,
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel
Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
