Electronics Forum | Fri Jun 10 09:02:58 EDT 2005 | ktron
Hi Guys.. Does anybody had experienced with designing the stencil for Right Angle LED without any dewetting problem on the LED termination? Currently our stencil opening is 1:1 and we still got so high reject due to this problem. Pls Advise, thanks
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Wed Jul 13 09:07:32 EDT 2005 | russ
The reason for going 1:1 with lead free is that it does not spread out like the pb solders. So 1:1 is really not necessary in my opinion. We go 1:1 anyway on discrete components along with other packages. You always have to make sure that the area
Electronics Forum | Tue Aug 02 11:17:27 EDT 2005 | Stefan
Tape feeders usually have a fixed pick position regardless of the package size. Is the component body off center in the tape pocket? I hope you can enter an offset in the feeder set up file. Also, perforation holes can deform, if the reel is too hea
Electronics Forum | Tue Aug 02 11:58:44 EDT 2005 | GS
Are the pick up nozzles metal made (ironmagnetic material)? Some time magnetic residual on metal nozzles can generate pbm like that when chips terminations have nickel and when SOt or similar packages have terminal A42 alloy made. Time ago got pbm l
Electronics Forum | Wed Aug 10 14:56:03 EDT 2005 | pjc
"Too Hot" is any more heat than what is needed to reflow the solder. You should have the Auto-Profile software for the machine, this will accurately monitor and record temps. There is also port for the component itself to monitor package temp. There
Electronics Forum | Mon Aug 22 15:15:59 EDT 2005 | PWH
Can I please get some opinions on the best way to kit/present parts to the SMT line for high mix/low volume board manufacturing? We currently kit builds using a scrap rate assigned to different package sizes. It is O.K. but could use some refinemen
Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is
Electronics Forum | Thu Sep 22 06:12:05 EDT 2005 | gavinscott
Hi All, I have been tasked with a project on the control of moisture sensitive devices and I was hoping to get some input from the experts out there... How do you monitor total exposure time for a MSD? If the packaging has been opened and re-sealed a
Electronics Forum | Thu Sep 22 09:04:29 EDT 2005 | gavinscott
The main problem that we have is the packaging for the MSD's can be opened and re-sealed a number of times before it hit's production, then it is opened again to be loaded into the machine and most of the time these parts are not consumed so they are
