Electronics Forum | Wed Nov 07 13:36:20 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Fri Nov 16 08:22:03 EST 2007 | ck_the_flip
For those of you who've completely switched to Pb-Free or who're running in a mixed environment, are you also buying or specifying the "RoHS PCBs" - the ones with * Greater Tg (glass transition temperature) * Thru-holes with limited drill hits and
Electronics Forum | Wed Dec 12 15:00:43 EST 2007 | mefunak
Hi,everybody! There is an interesting things happened with the 0402 components- machine Siemens HF3,it's an Emergency Stop error message " Component not at nozzle before placement" and there is a chance to find an extra components lying in a mess on
Electronics Forum | Wed Dec 19 23:53:04 EST 2007 | daxman
Hey Logan, This is an excellent resourse and should have pretty much everything you need. http://www.national.com/packaging/parts/MDIP.html#8 You get a list of a lot of different components and their pictures. You can view their dimensions and look
Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech
Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra
Electronics Forum | Sat Jun 28 13:53:07 EDT 2008 | sleech
Fowler: Thank you for your documentation. Your finding roughly coincide with our own. We also found that 70 degree baking removes 50%/60% of the ingested moisture from moisture conditioned MSD packages We ran an additional experiment that compared
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd
Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder
Electronics Forum | Thu Feb 21 15:11:29 EST 2008 | jlawson
Gerber standard has been around for long time as a fabrication data model for PCB makers, but not very useful for assemblers as no centroid data is actually present in the data. Also netlists are no supported and have to be calcualated with software
Electronics Forum | Fri May 16 03:37:04 EDT 2008 | ianlg
Hi There is a Benchtest on the EPP Stand at the SMT Hybrid & Packaging exhibition that may be on interest to you where 11 printers are going to be tested against each other. It should be interesting to all who are looking to purchase a screen printe