Electronics Forum | Fri Oct 22 09:44:42 EDT 1999 | John Bashe
The CCGA package is difficult to handle and automate in the assembly process. The leads can be fragile, and vision recognition of the package and leads is difficult. Special lighting and/or a special vision algorithm will probably be needed if you wa
Electronics Forum | Wed Aug 04 22:42:16 EDT 1999 | MarkD.
I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc. I
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Fri Jan 10 14:11:27 EST 2003 | genny
It's always safer to use a higher voltage cap than a lower voltage cap. It isn't a fuse... There is only one case where we dropped the voltage on a cap. We were using a tantalum cap that was rated to 16V, but had been built in the standard packagi
Electronics Forum | Thu Oct 02 13:37:52 EDT 2003 | gregp
"Proper industry naming conventions" I believe does not exist. You must make your own comprehensive convention and force all those that create the new package types to first scour the database to see if the part already exists. Sometimes it will be
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Mon Jan 07 17:51:34 EST 2008 | jmelson
The clear plastic packaging for LEDs is a LOT softer thermoplastic than the thermoset epoxies used on ordinary chips. I think people have had high failure rates when reflowing LEDs in all-plastic packages even at SnPb temperatures, and much worse at