Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Mon Aug 23 19:14:55 EDT 1999 | Kris Harris
| IF anyone is placing 0402's with the Mydata tp-18 I would like to here how reliable it is(with these little buggers). | | | Thanks | | MD Cox | MD Cox, We have a TP11-UFP and were very skeptical about placing 0402's. We bought the feeder and
Electronics Forum | Tue Aug 17 22:51:32 EDT 1999 | KEVIN SIMPSON
| | Does any one have any idea which is usualy more expensive, to get components on Reels or in Trays ( I mean large components ofcourse). | | What is price diffrence percentage ? | | | | practicaly, is one method is prefered to the other? | | | |
Electronics Forum | Tue Aug 17 14:08:50 EDT 1999 | Glenn Robertson
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
Electronics Forum | Fri Aug 13 13:38:23 EDT 1999 | Bian Wycoff
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I have used thetechnique extensiv
Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven
| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s
Electronics Forum | Thu Jul 22 04:53:54 EDT 1999 | George Verboven
| Looking for a cross-referencing and part identification guide for surface-mount components. There is very little infomation provided on some of the components themselves, and we often don't have parts lists or schematics for items we repair, so ide
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
