Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Fri Jul 24 12:02:06 EDT 1998 | Steve Gregory
Stoney, One thing you might do before you start dispensing epoxy, (...I know this might be a bit of a pain) is to run your boards on the mesh belt instead of the edge-rail conveyer. I used to have to do that with some very,very dense double sided mem
Electronics Forum | Fri Jul 24 13:45:12 EDT 1998 | Bob Willis
Yes you need solder paste for BGA. Have a look at the Free BGA documents on my home page which you can download. They cover design, rework, and general assembly www.bobwillis.co.uk | My firm has just begun it's first PCB that will use BGA packaging.
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Mon Aug 03 20:17:43 EDT 1998 | Dave Kalen
(fishing).. | Has Sanyo developed a bulk feeder for 201's and do you feel that bulk feeding will be the next big move in placement equipment? | In New England people are talking bulk feeding, but few people have elected to go that way. | As wit
Electronics Forum | Fri Jul 10 14:16:06 EDT 1998 | Bob Willis
As Steve said there should not be a problem with cracking plastic components but if you are reaching 180c there will be a problem with secondary reflow on the top side of the board. PCBs flex during wave soldering as they do during reflow if not supp
Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Wed Jun 24 16:30:37 EDT 1998 | Justin Medernach
Hi all, I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process terminolog
Electronics Forum | Wed Jun 24 20:06:42 EDT 1998 | Dave F
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach
| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te
