Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Tue Nov 09 22:43:39 EST 2004 | Fengang
Hi all, Yesterday I met a VCO(Vector-Controlled Oscillator) supplier, who provided the component spec -- peak temperature over 240 centigrade stands 7secs. But this spec is obviously different from our spec -- 260 centigrade 10secs. They told me th
Electronics Forum | Wed Jan 05 10:55:12 EST 2005 | OverTheHill
WOW Sr.Tech, 40K worth of bent tools? I'm about ready to be sh*t canned because of 1K's worth. As for trimming the mags, the product is running fine (many boards) and then out of nowhere the tool bends, so I assume my PERFECT operators trimmed the ma
Electronics Forum | Mon Jan 10 11:08:39 EST 2005 | mrgman9999
We are having a problem with popcorning of a plastic BGA that has been under careful humidity control. We have had problems in the past and some have been related to too much trapped internal solvents from the die attach epoxy. We did a life time b
Electronics Forum | Sat Feb 26 22:32:42 EST 2005 | siverts
The directive is called RoHS. Meaning that is not only the lead that is the issue. The materials need to whithstand a hihger temperature, not only delta T is an issue (but huge). Moisture sensitive devices: how to handle these? You will see an increa
Electronics Forum | Fri Sep 22 02:19:25 EDT 2006 | lead free tester
The directive is called RoHS. Meaning that is > not only the lead that is the issue. The > materials need to whithstand a hihger > temperature, not only delta T is an issue (but > huge). Moisture sensitive devices: how to handle > these? You wil
Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg
Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.
We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or
Electronics Forum | Thu Apr 21 17:46:17 EDT 2005 | Frank
Russ, Your math is right, but you are converting the wrong direction. I belive: 0201s use millimeters for specification sizes, not inches. And 01005 use millimeters for specification sizes, not inches. And it may be like that for all passives, bu
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