Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty
Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for
Electronics Forum | Wed Feb 28 12:34:21 EST 2007 | rob_thomas
Every component has a "how to order" paragraph in their data sheet with specific suffixes,letter/digit combinations that reflect each parameter of that part including packaging, lead finish etc. So if you order using the manufacturer p/n you are alm
Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K
Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh
Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Fri Jun 22 16:18:38 EDT 2007 | mika
Hi, I am interested of what the Fuji field engineers has to say about this? I trust You did not do all of this "replacement & calibration" by yourself? Is this happend randomly in a previuos known good pattern program, or just with a certain parts
Electronics Forum | Thu Jul 12 07:38:23 EDT 2007 | avalancher
Hey Sr, I agree that 130 is enough to pull a tiny little 0402, but I think that your forgetting response time. The machine has a small reservoir built in the system that keeps some moderate standing vacuum, however, when a part is picked, there
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
